| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a rotation-support mechanism for a wafer chuck and a resist film coating device, wherein a dust sticking to a holding surface of the wafer chuck is removed. SOLUTION: A resist film coating device 30 holds six wafer chucks 32A-F and a wafer chuck 32 and is provided with a rotation-supporting body 34 with such rotation mechanisms as free rotation and stop being allowed and a washing vessel 36 where the wafer chuck 32 is washed. Each wafer chuck 32 has holding flat surfaces 38A-F for holding a wafer and chuck axes 40A-F which are orthogonal to each holding flat surface. The rotation-supporting body 34 comprises a horizontal rotating axis 42 and holds the wafer chuck 32, so that a chuck axis 40 is orthogonal to the rotating axis 42. The washing vessel 36 is provided below the rotation-supporting body 34, while housing a washing liquid 45 for washing the holding surface of the wafer chuck, positioned on the lower side of the rotation-supporting body 34. The holding surface of the wafer chuck driven out of the washing liquid 45 has no dust stuck on it.</p> |
