发明名称 |
ANTIFUSE STRUCTURE AND ITS FABRICATION PROCESS |
摘要 |
PROBLEM TO BE SOLVED: To provide an antifuse structure and method for personalizing a semiconductor device which can overcome the limitations of the prior art. SOLUTION: An antifuse 100 of the preferred embodiment comprises a two layer transformble insulator core between two electrodes 102, 104. The transformable insulator core is normally non-conductive but can be transformed into a conductive material by supplying a sufficient voltage across the electrodes 102, 104. The two layer core preferably comprises an injector layer 106 and a dielectric layer 108. The injector layer 106 preferably comprises a two phase material such as silicon rich nitride or silicon rich oxide. Initially, the injector layer 106 and the dielectric layer 108 are non-conductive. When a sufficient voltage is applied, the core fuses together and becomes conductive. |
申请公布号 |
JPH10335465(A) |
申请公布日期 |
1998.12.18 |
申请号 |
JP19980116516 |
申请日期 |
1998.04.27 |
申请人 |
INTERNATL BUSINESS MACH CORP <IBM> |
发明人 |
BHATTACHARYYA ARUP;GEFFKEN ROBERT M;LAM CHUNG H;LEIDY ROBERT K |
分类号 |
H01L21/82;H01L23/525;(IPC1-7):H01L21/82 |
主分类号 |
H01L21/82 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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