发明名称 ANTIFUSE STRUCTURE AND ITS FABRICATION PROCESS
摘要 PROBLEM TO BE SOLVED: To provide an antifuse structure and method for personalizing a semiconductor device which can overcome the limitations of the prior art. SOLUTION: An antifuse 100 of the preferred embodiment comprises a two layer transformble insulator core between two electrodes 102, 104. The transformable insulator core is normally non-conductive but can be transformed into a conductive material by supplying a sufficient voltage across the electrodes 102, 104. The two layer core preferably comprises an injector layer 106 and a dielectric layer 108. The injector layer 106 preferably comprises a two phase material such as silicon rich nitride or silicon rich oxide. Initially, the injector layer 106 and the dielectric layer 108 are non-conductive. When a sufficient voltage is applied, the core fuses together and becomes conductive.
申请公布号 JPH10335465(A) 申请公布日期 1998.12.18
申请号 JP19980116516 申请日期 1998.04.27
申请人 INTERNATL BUSINESS MACH CORP <IBM> 发明人 BHATTACHARYYA ARUP;GEFFKEN ROBERT M;LAM CHUNG H;LEIDY ROBERT K
分类号 H01L21/82;H01L23/525;(IPC1-7):H01L21/82 主分类号 H01L21/82
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