FORMING METHOD OF HOLLOW CONDUCTOR AND MANUFACTURE OF SEMICONDUCTOR DEVICE,申请号JP19970141594-传众专利搜索

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发明名称	FORMING METHOD OF HOLLOW CONDUCTOR AND MANUFACTURE OF SEMICONDUCTOR DEVICE
摘要
申请公布号	JPH10335257(A)	申请公布日期	1998.12.18
申请号	JP19970141594	申请日期	1997.05.30
申请人	SONY CORP	发明人	EJIRI YOICHI
分类号	H01L21/28;B81C1/00;H01L21/768;H01L23/522;(IPC1-7):H01L21/28	主分类号	H01L21/28
代理机构		代理人
主权项
地址

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