LEAD FRAME AND ITS MANUFACTURE

摘要

PROBLEM TO BE SOLVED: To provide a lead frame having plated layers the embrittlement of which can be prevented during the course of the manufacturing process of the lead frame and a method for manufacturing the lead frame. SOLUTION: In a method for manufacturing lead frame, an Ni-Mn alloy layer 32 is applied to the surface of a metallic substrate 31 after the surface is degreased and activated and a Pd or Pd alloy layer 33 is applied to the surface of the layer 32. The embrittlement of plated layers can be prevented by the Ni-Mn alloy layer 32 which is the base plated layer of a lead frame 30 and the occurrence of cracks caused by bending in trim and form forming steps in a semiconductor manufacturing process can be prevented.