| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a method for bonding tape to a wafer in such a manner that an adhesive layer of the tape will not be left on the bonding face of the wafer after the tape is released from the wafer, and also to provide a tape bonding apparatus. SOLUTION: First, a decompressing step is carried out to decompress a gas atmosphere around a wafer 40 having a step in its rear side. A tape bonding step is next carried out for bonding an adhesive tape 16 onto the rear side of the wafer 40. The adhesive tape 16 has such a property that, when irradiated with ultraviolet rays under an atmosphere having a low oxygen concentration, the adhesion force of the tape is reduced. As a result, the adhesive tap 16 is applied onto the rear side of the wafer 40, with air in a gap between a step in the wafer 40 and an adhesive layer 18 of the tape 16 being substantially excluded. Next, an adhesion force reducing step is carried out for irradiating ultraviolet rays onto the tape 16. When the tape 16 is peeled off from the wafer, any tape adhesive will not be left on the wafer.</p> |
