发明名称 WAFER ALLIGNMENT AND APPARATUS THEREFOR
摘要 <p>PROBLEM TO BE SOLVED: To enable collective adjustment of center and orientation with respect to a plurality of wafers to be treated. SOLUTION: The apparatus includes a support part 7 capable of elevating for lifting up peripheral edges of a plurality of wafers W to be treated supported in horizontal condition at multiple stages and transferred from a horizontal direction by means of a transfer arm 6, support columns 20 disposed around the support part 7 movably in nearly its radial direction for collectively centering the wafers W as contacted with the peripheral edges of the wafers W at least from three directions, rotary tables 29 provided in multiple stages as associated with the support part 7 therein for carrying the wafers W thereon as the support part moves down, a detector 45 for detecting a positioning mark 4 provided to the peripheral edge of each wafers W, and a controller 46 for controlling rotations in the rotary tables 29 in such a manner that a detection signal issued from the detector 45 causes the marks to be aligned along one direction.</p>
申请公布号 JPH10335429(A) 申请公布日期 1998.12.18
申请号 JP19970161911 申请日期 1997.06.04
申请人 TOKYO ELECTRON LTD 发明人 TANIGAWA OSAMU;ONO YUJI
分类号 H01L21/677;H01L21/68;(IPC1-7):H01L21/68 主分类号 H01L21/677
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