| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a wafer treating apparatus which is easy to control the time and accurately control the thermal history of wafers and superior in view of the wafer treatment throughput. SOLUTION: The treatment comprises step S1 of inputting the wafer flow by the operator, S2 of selectively setting between the passing and no passing, wherein the passing is not permitted in case the time control such as thermal history is rigorously required or wafers are individually treated, S3 of judging the set passing flag whether the passing is permitted, S5 of carrying/treating the wafers in the passing mode if permitted, and S4 of carrying/treating the wafer in the no passing mode if the passing is not permitted.</p> |
