MULTILAYERED CIRCUIT BOARD AND HYBRID INTEGRATED CIRCUIT USING THE BOARD

摘要

PROBLEM TO BE SOLVED: To provide a multilayered circuit board which has a high interlayer connection reliability and a good productivity. SOLUTION: This is a multilayer circuit board, wherein at least one of conductor circuit layers 3 which is not the outermost layer is partially exposed, and at least one of the conductor circuit layers having exposed sections is electrically connected to the conductor circuit layer in the outermost layer via a conductive adhesive 7 and a conductive component 8. In such a multilayered circuit board, the shape of the exposed section is preferably a square or a rectangle, and the area is 0.25 mm<2> or larger.