| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a multilayered ceramic circuit board, wherein a surface interconnecting conductor can be formed with high positioning accuracy and chip-like electronic components can be mounted with high accuracy and positioning can be done easily and which has a superior manufacturing efficiency. SOLUTION: This multilayered ceramic circuit board has a surface interconnecting conductor 3 connected to inside interconnecting conductors 2... and electronic components 5 connected to the surface interconnecting conductor 3, located on the surface of a laminate 1 made by stacking a plurality of ceramic layers 1a-1f with the inside interconnecting conductors 2... being formed between the layers. In the laminate 1, a positioning through-hole 6 made by aligning through-holes 6a-6f formed in the ceramic layers 1a-1f is formed in the thickness direction, as well the diameter of the through-hole 6a of the ceramic layer 1a constituting the surface is made smallest.</p> |
