| 摘要 |
PROBLEM TO BE SOLVED: To avoid damages on a chip, and to directly wire-bond chips by providing a ball part at a pad. SOLUTION: A ball part 16, in which only a ball bonding gold ball is formed, is formed on a pad 13. The height of the ball part 16 is made higher than at least that of a passivation coating 14. A wire 10 which is 1st bonded to another part by a capillary 11 is moved around on the ball part 16, and the wire is crushed by a pressing part 11a of the capillary 11 so that the wire 10 can be fixed to the ball part 16. |
