| 摘要 |
PROBLEM TO BE SOLVED: To improve the reliability of a copper clad laminated board, wherein a tape with a new bonding agent for wire bonding having excellent adhesive power and insulation reliability is used, a semiconductor connection substrate, a semiconductor integrated circuit connecting substrate and a semiconductor device. SOLUTION: In this wire bonding tape with adhesive agent formed by a laminated body, having an adhesive agent layer on an organic insulative film, DC voltage of 100 V is applied under the environment of the softening temperature after hardening of the above-mentioned adhesive layer at 120 to 200 deg.C, the storage elastic coefficient E' at 150 deg.C of 20 to 100 MPa, and 85% RH at 130 deg.C, and the insulation resistance decline time when the tape is left alone is set at 50 hours or longer. |
