ELECTRONIC PARTS ASSEMBLY HAVING SEALING MATERIAL AND ITS FORMATION

摘要

PROBLEM TO BE SOLVED: To provide a method by which a semiconductor device can be sealed without requiring the formation of a dam structure around the device. SOLUTION: An electronic parts assembly 10 is formed by mounting electronic parts 31 on a substrate 11. A sealing material 33 is used for protecting the parts 31 from the harm from the surrounding environment. The material 33 is formed by applying a sealing fluid to the parts 31. Trenches 36 are dug into a mask layer 21 formed on a substrate 11 so as to stop the flow of the sealing fluid. The trenches 36 provide edge sections which behave themselves as discontinuity on the surface 23 of the mask layer 21. The discontinuity is sufficient to control the flow of the sealing fluid until the fluid is hardened to form the sealing material 33.