| 摘要 |
PROBLEM TO BE SOLVED: To provide an electronic circuit device which has high junction reliability, a high heat radiating characteristic, and is reduced in electromagnetic wave noise by constantly maintaining the gap amount between an electronic circuit element and a circuit board and a method for manufacturing the device. SOLUTION: At the time of facing a circuit board 160 having electrode sections at the positions corresponding to the electrode sections of an electronic circuit element, such as the BGA(ball grid array) 164, etc., having many electrode sections to the PGA 164 and joining the electrode sections of the BGA 164 to the electrode sections of the circuit board 160, a sheet 170 having through holes 171 at the positions corresponding to the electrode sections of the PGA 164 is interposed between the BGA 164 and the circuit board 160 and the electrode sections of the BGA 164 are joined to the electrode sections of the circuit board 160 through the solder bumps 166 of the BGA 164 and the soldering lands 150 of the circuit board 160 in the through holes of the sheet 170. |
