| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a wafer-sawing device that can effectively remove silicon powder and heat generated in a wafer-sawing process for improving the yield and productivity in the assembling process of a semiconductor element. SOLUTION: A wafer-sawing device 10 scribes a wafer 50 having a plurality of IC chips 52 partitioned by a plurality of streets 54, so as to divide the wafer 50 into the unit IC chips 52. The wafer-sawing device 10 has a rotating cutting blade 20 moving along the streets 54, two side nozzles 22 positioned at both sides of the cutting blade 20 and for jetting cleaning liquid at a desired angle with respect to the cutting blade 20 and the surface of the wafer 50, a center nozzle 24 positioned ahead of the direction in which the cutting blade 20 is moved and for jetting cleaning liquid at a desired angle to the cutting blade 20 and the surface of the wafer 50, and a suction nozzle 32 for sucking silicon powder produced by the cutting blade 20 from the surface of the wafer 50.</p> |
