| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a semiconductor device on which a mounting operation can be performed easily by collective reflow, the generation of a defective article can be suppressed when mounting, mounting reliability can be enhanced and productivity can be increased. SOLUTION: This semiconductor device is mounted on a mounting substrate using bumps. Between solder bumps 3 welded to a plurality of electrode pads 2 of a flip chip (or package) 1, is partitioned by a barrier 4 in such a manner that the barrier 4 is provided separately from the solder bumps 3, and a thermoplastic adhesive layer 5 is formed on a part or on the whole surface opposing to the mounting substrate of the barrier 4.</p> |
