| 摘要 |
<p>PROBLEM TO BE SOLVED: To reduce the occurrence of dust while the excellent cooling performance of an electrostatic chuck resulting from the good adhesion between a wafer and the chuck is maintained by successively providing a first insulating layer, a conductive pattern formed as an electrode, and a second insulating layer made of silicone rubber carrying a crimp pattern on its surface on a metallic substrate. SOLUTION: An electrostatic chuck is constituted by successively providing a first insulating layer 3 made of silicone rubber, a conductive pattern 6 formed as an electrode, and a second insulating layer 1 made of silicone rubber carrying a crimp pattern on its surface on a metallic substrate 5. In addition, the effective contact area of the chuck with a wafer is formed so that the area may become 20-90% of the whole area of the wafer. Consequently, the contact area of the chuck can be reduced effectively to a level at which the cooling performance of the chuck is not deteriorated and the adhesion of dust can be reduced. In addition, since the elastic silicone rubber is used for the insulating layers 1 and 3, the adhesion of the chuck with irregularities on the rear surface of the wafer is improved and the temperature of the wafer can be maintained uniformly.</p> |
