| 摘要 |
PROBLEM TO BE SOLVED: To form an inner layer circuit pattern without conducting a copper plating and etching thereof in a multilayered printed board of BVH or IVH structure. SOLUTION: Inner layer circuit patterns 301, 302 are formed on both faces of a prepreg 300 and, continuity holes 102, 202 which reach the inner layer circuit patterns of the prepreg 300 are formed in each of single-sided copper clad substrates 100, 200. Then, the prepreg 300 and the single-sided copper clad substrates 100 and 200 are stacked, with the prepreg 30 interposed between the copper clad substrates 100 and 200, and pressed. After copper-plating the copper foils 101, 201 of the single-sided copper clad substitutes 100, 200 and the continuity holes 102, 202, outer layer circuit patterns 104, 204 are formed on the single-sided copper clad substrates 100, 200 respectively. |
