| 摘要 |
PROBLEM TO BE SOLVED: To effectively suppress foreign matters, such as dust from penetrating in treating units in a liq. treating system for substrates from external apparatus such as an aligner, thereby improving the yield. SOLUTION: A first carrier unit 31 for taking in/out wafers for a group 33 of open-type treating units is disposed apart from a second carrier unit 32 for taking in/out the wafers for a spinner-type treating units, so as to transfer the wafers between the carrier units 31, 32 through extension units EXT in the group 33 of treating units. An interface 12 for transferring the wafer to/from an aligner is disposed parallel to the first unit 31, so as to transfer the wafers only between the first unit with the interface 12. |
