| 摘要 |
PROBLEM TO BE SOLVED: To improve resin adhesion and reliability without degrading bonding characteristics by forming a silver plate layer on lead frame material and further forming a copper or copper compound film on the silver plate layer. SOLUTION: The adhesion of silver paste resin and that of mold resin can be improved without degrading wire bonding characteristics by forming the copper or copper compound thin film on the silver plate layer of lead frame material. Accordingly, the lead frame comprises lead frame material 1, a silver plate layer 2 provided on the surface of the lead frame material 1, and a copper or copper compound film layer 3 of e.g. copper oxide. As the lead frame material 1, pure copper, copper alloy and the like are employed. The copper or copper compound film 3 formed on the silver plate layer 2 is formed by thin-film formation such as electrolytic plating. The thickness of the film 3 preferably ranges from that of a monoatomic layer to 500 Å. |
