发明名称 RESIN SEALING DEVICE FOR SEMICONDUCTOR ELEMENT
摘要 PROBLEM TO BE SOLVED: To attain a fully automatic operation by facilitating cutting a gate and pulling out a product, and easily cleaning resin dregs. SOLUTION: A carrier plate 120 for pressing a substrate end part is provided between a substrate 2 and a runner 122, a resin 126 is sealed into a sealing cavity 130 to the carrier plate 120, without bringing the runner 122 into contact with the substrate 2. This device is provided with a carrier plate conveying means for horizontally conveying the carrier plate 120, so that the carrier plate 120 and the substrate 2 can be pulled out of a metallic mold 100 in the horizontal direction after the resin sealed.
申请公布号 JPH10335360(A) 申请公布日期 1998.12.18
申请号 JP19970136924 申请日期 1997.05.27
申请人 SUMITOMO HEAVY IND LTD 发明人 KISHI YUICHI
分类号 H01L23/29;H01L21/56;H01L23/31 主分类号 H01L23/29
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