| 摘要 |
PROBLEM TO BE SOLVED: To effectively give a more pressure to a part of a wafer which is desired to be pressed with a more pressure so as to easily improve the amount of abrasion in uniformity throughout the surface of the wafer, by a method wherein a mechanism which sucks a part of the rear of the wafer and gives a pressure to the rest of the rear is provided. SOLUTION: Pressing flow paths 6 are provided inside a carrier 2 and communicate with a part near the rear center of a wafer 1, and the rear center of the wafer 1 can be pressed with N2 gas through the pressing flow paths 6. On the other hand, vacuum chuck flow paths 7 are provided inside the carrier and communicate with a part near the periphery of the rear of the wafer 1, the periphery of the wafer 1 is vacuum-chucked through the vacuum chuck flow paths 7 when the wafer 1 is subjected to polishing, and then the carrier 2 and a platen 8 are rotated at the same time. At this point, polishing liquid starts to be fed onto a polishing cloth 9, and the carrier 2 touches down a polishing cloth 9. |
