| 摘要 |
<p>A microfabricated device (10) having a high vertical aspect ratio and electrical isolation (18) between a structure region (14) and a circuit region (12). The device is fabricated on substrate (16) and includes electrical interconnections between the structure region (14) and the circuit regions (12). The device includes an isolation tench (18) surrounding structure region (14) and having a lining of insulating material. A plurality of microstructure elements (24, 26, 30a, 30b, 32) are located in structure region (14) and are laterally anchored to the isolation trench (18).</p> |
