发明名称 HEAT-RESISTANT FIBER PAPER
摘要 <p>A heat-resistant fiber paper composed mainly of a short fiber of a heat-resistant organic, high-molecular-weight polymer and a fibrid of a heat-resistant organic, high-molecular-weight polymer, wherein the content of the short fiber in the total weight of the paper is 40 to 97 % by weight, the content of the fibrid in the total weight of the paper is 3 to 60 % by weight, and the fibrid is partially softened and/or melted to allow the fibrid to act as a binder. This paper possesses excellent heat resistance, thermal dimensional stability, interlaminar peel strength, electrical insulating properties under high humidity conditions and other properties. In addition, it has good resin impregnation despite high bulk density and is particularly suitable as a substrate for an electrical insulating material and a substrate for a laminate for an electric circuit.</p>
申请公布号 WO9856987(A1) 申请公布日期 1998.12.17
申请号 WO1998JP02352 申请日期 1998.05.28
申请人 TEIJIN LIMITED;MURAYAMA, SADAMITSU;MATSUI, MICHIKAGE 发明人 MURAYAMA, SADAMITSU;MATSUI, MICHIKAGE
分类号 C08J5/24;B32B5/28;C08J5/06;D01F6/60;D21H13/20;D21H13/24;D21H13/26;D21H25/06;H05K1/03;(IPC1-7):D21H13/26 主分类号 C08J5/24
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