| 摘要 |
PROBLEM TO BE SOLVED: To contrive the miniaturization of a circuit component, by a method wherein a triazine thiol compound film is formed on the surfaces of the conductive metal bodies of a primary circuit component, and a synthetic resin which is insulative and can be bonded chemically to a triazine thiol compound is injection molded in such a way as to cover the film to form a molded part. SOLUTION: A copper plating is applied to both surfaces of the surface and rear of a substrate 1 to form primary side conductor patterns 1A and 1B. Then, an electroless copper plating is applied to this substrate 1. The surfaces of these primary side conductor patterns 1A and 1B are treated with an aqueous solution consisting of triazine thiols to form a triazine thiol copper salt film 3 on the surface of the copper plating. Then, this primary circuit component B is inserted in a molded circuit component, the component B is subjected to secondary molding by injection molding using an ABS resin, and the periphery of the component B is covered with a secondary molded part 2. |
