| 摘要 |
An insulator having a main component of silicon dioxide is characterised by the insulator including at least one organic polymer such as benzene nuclei distributed therein in order to reduce a dielectric constant thereof The layer is formed by chemical vapour deposition and the benzene nuclei may be derived from phenyltrimethylsilane or phenyltrimethoxysilane. Other organic polymers may be based on toluene, xylene, naptholene, biphenyl or anthracene. The insulator may have pores formed therein by the removal of the organic polymer. A multi-level interconnection structure comprising at least one first level interconnection provided on an insulating layer; an insulator having a main component of silicon dioxide and including at least one organic polymer distributed therein as referred to above and having at least one via hole; and at least one second level interconnection provided on said insulator, the or each second level interconnection being electrically connected by means of a respective via hole to a respective first level interconnection. |
