<p>The present invention provides a method of forming a fluidtight electrical conduit through a high aspect ratio hole, the method comprising sintering a via ink to form the electrical conduit and to seal the hole.</p>
申请公布号
EP0883442(A1)
申请公布日期
1998.12.16
申请号
EP19950940663
申请日期
1995.11.09
申请人
SARNOFF CORPORATION
发明人
ZANZUCCHI, PETER, J.;BURTON, CHARLOTTE, A.;MCBRIDE, STERLING, E.;DEMERS, ROBERT
