METHOD FOR MANUFACTURING ELECTRONIC CIRCUIT DEVICE

摘要

A subject of the present invention is to provide a process for manufacturing an electronic circuit device by which solder can be applied at a low cost by fluxless bonding that enables uniform and simple application of solder and requires no cleaning step. The present invention is a process for manufacturing an electronic circuit device by applying a solder material to electronic parts or electrodes on a printed circuit board; the process comprising the steps of removing an initial surface oxide film and an organic contaminant film from the surfaces of the solder material and electrode, covering the solder material and an area to which solder is to be applied which is comprised of the electrode, with a liquid capable of vaporizing up after the bonding is completed in the step of heat-melting the solder material, to thereby prevent reoxidation of the joining area surface, and heat-melting the solder material, to carry out solder bonding without using any flux.