| 摘要 |
The invention concerns a device for dismantling and fitting a bonded-in element, according to which the connection between the element and the component is brought about by at least one layer of adhesive, at least one cutting element being inserted between the element and the component. The cutting element is disposed such that the layer of adhesive can easily be cut by pulling on a cutting wire. If the element is to be re-fitted, a cutting element can again be inserted, so that the element can also be easily removed the next time dismantling is necessary. |
