APPARATUS FOR AUTOMATICALLY MOUNTING ELECTRONIC COMPONENTS

摘要

An improved apparatus for automatically mounting electronic components wherein a take-out nozzle is rotated by a nozzle rotating unit based on data on an angular position assumed by each chip-shaped electronic component firmly held on the take-out nozzle in order to perform a correcting operation so as to allow the electronic component to assume an adequate angular position and, after completion of the correction operation, the respective electronic components are mounted on a printed-circuit board is disclosed. The apparatus includes a storing unit in which an allowable error range is stored, a comparing unit for determining whether or not the present angular positions assumed by the respective electronic components and recognized by a recognized unit remain within the allowable error range, and a controlling unit for controlling the nozzle rotating unit so as to allow a correcting operation to be repeatedly performed based on results derived from the determination made by the comparing unit, until the respective recognized angular positions remain within the allowable error range.