发明名称 RESIN SEALING DEVICE FOR SEMICONDUCTOR APPARATUS AND RESIN SEALING METHOD THEREOF
摘要 PROBLEM TO BE SOLVED: To prevent the occurrence of voids due to the entrainment of air among granules at the time of sealing in use of resin of powder, granule, etc., solve drawbacks regarding a sealing process such as wire flow or non-charged failure, miniaturize the size of the device, and shorten sealing cycles. SOLUTION: The device includes a screw 8 movable toward and away from a plunger part 6 for forming a pot portion 7 being a part of the sealing device. Then, granular resin 9 placed at the tip of the plunger part 6 is melted by heat of a mold 1 or the like, and then it is compressed to be concentrated in density by movement of the screw 8 before kneading. As such, an entrainment of air is reduced in molten resin.
申请公布号 JPH10329182(A) 申请公布日期 1998.12.15
申请号 JP19970139991 申请日期 1997.05.29
申请人 NEC CORP 发明人 NAKAMURA TAKU
分类号 B29C45/73;B29C45/02;B29C45/14;B29C45/53;B29C45/78;B29L31/34;H01L21/56;(IPC1-7):B29C45/53 主分类号 B29C45/73
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