| 摘要 |
PROBLEM TO BE SOLVED: To provide a working method useful to polish and flatten semiconductor silicon wafers, wiring material formed on the silicon wafer, layer-to-layer insulation film formed at the time of making multilayer interconnection, and the like. SOLUTION: This polishing method is to use a resin grinding wheel having indispensable composition foaming property thermosetting resin 100 volume % provided with foaming property by self-foaming property or a foaming agent of 50 deg.C to 180 deg.C softening temperature and abrasive grains 50 to 200 volume % of an average diameter of 0.1 to 5 μm. The manufacturing method of the resin grinding wheel is to smash independently the foaming thermosetting resin, which is provided with a foaming property by a self-foaming property or a foam agent of 50 deg.C to 180 deg.C softening temperature or together with the abrasive grains of an average of 0.5 to 5 μm, to the foaming thermosetting resin of an average particle diameter of not more than 5 μm and, after dispersedly mixing the two uniformly, the mixture is put into a mold and formed to have 40 to 60 volume m% of porosity under the temperature of 140 deg.C to 220 deg.C and pressure of 0.1 to 20 kg/cm<2> . |
