发明名称 SOUND ABSORBING THERMOPLASTIC RESIN PARTICLE MOLDING
摘要 PROBLEM TO BE SOLVED: To provide resin particle molding having sound absorption properties in a wide frequency range with communicating air gaps. SOLUTION: In the molding having 45 to 80% of a space ratio at the time of closest packing and communicating air gaps and made of thermoplastic resin particles having 1 to 8 mg of mean weight per one particle, sound absorption ratios at central frequencies obtained by a reverberant absorption ratio measuring method according to JIS A 1409 with void factor of 15 to 60% and bulk density of 00.1 to 0.6 g/cm<3> are 250, 315, 400, 500, 630, 800, 1000, 1250, 1600, 2000, 2500, 3150 (Hz) so that the central frequency measuring points in which the ratio is 70% or more are existed continuously at three or more points, and the same points in which the ratio is 50% or more are existed continuously at seven or more points.
申请公布号 JPH10329220(A) 申请公布日期 1998.12.15
申请号 JP19980103613 申请日期 1998.03.31
申请人 JSP CORP 发明人 TOKORO TOSHIO;YAMAZAKI HIROSHI;SHIOTANI AKIRA;SHINOHARA MITSURU
分类号 B29C67/20;B29K101/12;B29K105/04;B29L31/10;G10K11/162;(IPC1-7):B29C67/20 主分类号 B29C67/20
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