| 摘要 |
PCT No. PCT/US96/04815 Sec. 371 Date Dec. 3, 1996 Sec. 102(e) Date Dec. 3, 1996 PCT Filed Apr. 10, 1996 PCT Pub. No. WO96/32283 PCT Pub. Date Oct. 17, 1996Printing heads which operate using coincident forces, drop on demand printing principles integrate many nozzles into a single monolithic silicon structure. Semiconductor processing methods such as photolithography and chemical etching are used to simultaneously fabricate a multitude of nozzles into the monolithic head. The nozzles are etched through the silicon substrate, allowing two dimensional arrays of nozzles for color printing. The manufacturing process can be based on existing CMOS, nMOS and bipolar semiconductor manufacturing processes, allowing fabrication in existing semiconductor fabrication facilities. Drive transistors, shift registers, and fault tolerance circuitry can be fabricated on the same wafer as the nozzles. The manufacturing process uses anisotropic wet etching to etch ink channels and nozzle barrels from the back surface of the wafer to the from surface of the wafer. The etching follows the crystallographic planes of the silicon, which result in highly accurate and consistent etch angles using simple etching equipment.
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