| 摘要 |
<p>PROBLEM TO BE SOLVED: To obtain an epoxy resin compsn. for semiconductor sealing excellent in flowability and solder crack resistance by compounding an epoxy resin compsn. comprising a 4,4'-biphenol-type epoxy resin crystalline at normal temp. and an amorphous epoxy resin having a low softening point with a curative therefor, an inorg. filler, and a cure accelerator. SOLUTION: 10-80 pts.wt. 4,4'-biphenol-type epoxy resin crystalline at normal temp. is mixed with 20-90 pts.wt. at least one amorphous epoxy resin having a softening point of 35-55 deg.C and prepd. by reacting at least one polyhydric phenol compd. selected from among bisphenol A (or F), phenol-novolak resins, cresol-novolak resins, phenol-aralkyl resins, terpene-phenol resins, dicyclopentadiene-phenol resins, phenol-cyclohexane resins, and phenol- benzaldehyde resins with an epihalohydrin, thus giving an epoxy resin compsn. crushable at normal temp.</p> |
