Multilayer electronic structure and its preparation

摘要

An electronic structure is formed of alternating layers of a metal and a cured ceramic-polymer mixture. The ceramic-polymer mixture is prepared by mixing small ceramic particles into a flowable, curable polymer. The mixture is spread over a first metallic layer and, optionally, B-stage cured. Additional metallic layers and ceramic-polymer layers are added in alternating fashion. Metallic interconnects may be provided through overlying ceramic-polymer layers to a particular metallic layer. The resulting structure is heated to a moderate temperature to cure the polymer.