发明名称 CARRIER FOR DOUBLE POLISHING AND DOUBLE LAPPING
摘要 PROBLEM TO BE SOLVED: To prevent the occurrence of fatigue fracture and metallic pollution by a method wherein the outer periphery region part of a carrier is formed of a metallic member covered with resin and an internal region is formed of a resin member. SOLUTION: A carrier 13 comprises an outer peripheral region part 10; and an internal region 11. An outer peripheral tooth 10a is formed at the outer periphery of the outer peripheral region part 10. The holding holes 11a of three semiconductor wafers are formed in the internal region part 10 at intervals of approximately 120 deg. point-symmetrically based on the center P of the carrier 13, and, for example, attendant abrasive feed holes are formed in a manner to mutually hold an object position relation. Electrophoresis coating is applied on the whole surface of an outer peripheral region part 10 by using epoxy resin to form a solid film having a uniform film thickness. The internal region part 11 consists of inorganic fiber-reinforced plastic, such as a glass fiber epoxy resin laminate or a carbon fiber epoxy resin laminate. This constitution prevents the occurrence of fatigue fracture and metallic pollution of the outer peripheral region part 10 on which a mechanical load is applied. Further, the internal region part 11 is also provided with chemical resistance and wear resistance.
申请公布号 JPH10329013(A) 申请公布日期 1998.12.15
申请号 JP19970157870 申请日期 1997.05.30
申请人 SHIN ETSU HANDOTAI CO LTD 发明人 MASUMURA HISASHI;SUZUKI KIYOSHI
分类号 B24B37/27;B24B37/28 主分类号 B24B37/27
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