| 发明名称 |
Baking of photoresist on wafers |
| 摘要 |
A method and apparatus for curing a photoresist that is deposited in liquid form and spun on a surface of a wafer leaving a thin film to be cured. This invention teaches methods for curing the resist with improved thickness control using front side heating.
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| 申请公布号 |
US5849582(A) |
申请公布日期 |
1998.12.15 |
| 申请号 |
US19970847224 |
申请日期 |
1997.05.01 |
| 申请人 |
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
发明人 |
CHEN, CHAO-CHEN;CHIU, WEI-KAY |
| 分类号 |
G03F7/40;(IPC1-7):G03C5/00 |
主分类号 |
G03F7/40 |
| 代理机构 |
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