发明名称 |
Ball contact for flip-chip devices |
摘要 |
A contact for a semiconductor device or passive substrate is made up of an array of conductive balls, the individual balls of the contact being a compressible material coated with a metal conductive material. The balls in the array are compressed while being bonded to the contact area to provide a larger bond area between the ball and the contact area to which it is bonded. |
申请公布号 |
US5849132(A) |
申请公布日期 |
1998.12.15 |
申请号 |
US19950485169 |
申请日期 |
1995.08.04 |
申请人 |
TEXAS INSTRUMENTS INCORPORATED |
发明人 |
CHIU, ANTHONY M. |
分类号 |
H01L21/48;H01L21/60;H01L23/485;H01L23/498;H05K3/32;H05K3/34;(IPC1-7):B05D3/12 |
主分类号 |
H01L21/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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