摘要 |
A method is provided for forming an integrated circuit contact structure. A conductive region (12) is formed on a semiconductor device (10). Thereafter an insulating layer (14,16,18) is formed over the conductive region (10). An opening (22) is then formed through the insulating region (14,16,18) to the conductive region (12). A thin barrier layer (26) is deposited over the integrated circuit contact structure. A portion of the thin barrier layer (26) is removed by backsputtering the integrated circuit contact structure so that only a thin barrier sidewall (28) remains. Finally, a conductive metal (30) layer is deposited over the integrated circuit contact structure. In one embodiment, the integrated circuit contact structure is baked before the conductive metal layer (30) is deposited. <IMAGE> |
申请人 |
SGS-THOMSON MICROELECTRONICS, INC., CARROLLTON, TEX., US |
发明人 |
CHEN, FUSEN E., MILPITAS, CALIFORNIA 95035, US;DIXIT, GIRISH A., DALLAS, DENTON COUNTY, TEXAS 75287, US;WEI, CHE-CHIA, PLANO COUNTY, TEXAS 75093, US |