Installation for galvanizing electronic circuit boards and similar items

摘要

The installation includes a housing with an electrolyte bath with metal ions, a transport system for moving circuit boards through the installation and at least one current source. There are contact elements which are electrically connected to the galvanizing current source, and contact the circuit boards in a way that the metal coatings on the boards are also at a negative potential. A copper removal unit (20) with a copper removal electrode (22) is located close to the contact elements and is connected to an auxiliary current source. The electrode (22) is enveloped by a cover unit (21, 23) filled with a thinned acid as an electrolyte. During operation of the installation, the electrode (22) communicates with the space filled with electrolyte with metal ions solely through the semipermeable, anion-active membrane (23).