| 发明名称 |
SOLVENTLESS FORMING METHOD FOR HEAT EXCHANGER PANELS |
| 摘要 |
A method for forming thermoplastic heat exchanger panels without using solvents, wherein a co-extruded film is used to provide a layer of toughened, heat-sealable nylon on a layer of regular nylon, and using such panels in a gas-assisted press bonding process to form the heat exchanger panels. |
| 申请公布号 |
WO9855815(A1) |
申请公布日期 |
1998.12.10 |
| 申请号 |
WO1998CA00569 |
申请日期 |
1998.06.05 |
| 申请人 |
DOSHI, SHAILESH;FARKAS, NICHOLAS;STEVENS, KENNETH, EARL |
发明人 |
DOSHI, SHAILESH;FARKAS, NICHOLAS;STEVENS, KENNETH, EARL |
| 分类号 |
B29C49/00;B29C49/02;B29C51/02;B29C69/00;B32B27/34;C08G81/00;C08L77/00;F28F21/06;(IPC1-7):F28F21/06;B29C51/00 |
主分类号 |
B29C49/00 |
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