DEVICE FOR COOLING ELECTRONIC COMPONENTS

摘要

Disclosed is a device for cooling electronic components, preferably high-performance laser diodes. The inventive device is configured as a microstructural heat sink comprising a plurality of individual layers and at least microchannel plate with a plurality of microchannels and a distribution channel. The inventive device also comprises an intermediate plate with one or several connecting channels and a collector plate with one or several collector channels. Once the microchannel plate, the intermediate plate and the collector plate are assembled along with a covering plate and a base plate for the individual layers, sealed cooling channels are formed. A cooling medium can be fed through said channels. The cooling medium is directed into the microstructural heat sink through an inlet and discharged therefrom through an outlet. The invention is characterized in that the intermediate plate for the cooling medium forms a graded and/or skewed transitional structure through which the cross section areas of the inlet and/or outlet arising from an all-layer vertical surface cut can be successively carried over into the cross section area of the microchannels arising from a vertical microplate cut in the area of the microchannels.