Verbindungsplattenanordnung für linearen dualen Schaltmodul

摘要

A low inductance linear semiconductor switching module has coplanar contacts (36a-f;74a-f). A pretestable terminal subassembly (90) is formed which can contain high power, high frequency semiconductor switching devices (10), operating at high power and low inductance. The module incorporates compositional, geometrical and electrical symmetry in a linear configuration. The terminal subassembly is readily fabricated and assembled into the module. In addition, it permits use of short internal leads that are readily connected to the terminal subassembly.