Chip carrier arrangement

摘要

The chip carrier arrangement has a substrate (2) carrying at least one chip (1). It also has a circuit board (4). The substrate main surfaces are associated with the lower side of the circuit board (4) and is fastened to it. At least one recess (8) is provided in the circuit board (4) to receive the chip (1). The chip (1) has several bond surfaces on its side furthest from the substrate (2). These are each electrically connected via a bond conductor (10) to a conductive track on the upper side of the circuit board (4). The bond conductors (10) are completely surrounded by an insulating resin (15). The substrate (2) has several electric conductor parts (13) on its main surface (3) nearest the lower side of the circuit board (4). These conductor parts (13) are each connected to a first (12) and a second (14) contact point. Several first contact points are provided on the foot side of the chip (1), via which the chip (1) is also electrically connected to the electric conductor parts.