METHOD AND APPARATUS FOR DISTRIBUTING A POLISHING AGENT ONTO A POLISHING ELEMENT

摘要

An apparatus for evenly polishing or planarizing the surfaces of workpieces includes a distributor (134) with a reservoir and a plurality of conduits (140) for uniformly guiding a fluid across a surface of a polishing material. The apparatus is configured to couple to a polishing machine that processes surfaces of workpieces such as semiconductor wafers and computer discs. The reservoir (138) receives a fluid from an exterior source and the fluid is pooled in the reservoir (138) before passing down the conduits (140) to the polishing material. When multiple conduits (140) are employed, the conduits (140) are evenly spaced around the distributor (134) to facilitate uniform application of fluid to a number of locations on the polishing material.