| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a component bonding method which sufficiently removes bubbles remaining between the component and a board, without requiring the use of a vacuum container. SOLUTION: A protruding part 32 which protrudes from the bonding surface 30 of a metal chip 18 functions as a spacer between the bonding plane 30 and a board 10 and prevents a side whereupon the protruding part 32 is provided from approaching, and the bonding plane 30 of the metal chip 18 is inclined tram the horizontal plane of the bonding plane 30. In such an inclining process, a bubble 34 remaining in solder 20 is shifted along the inclined bonding plane 30 due to surface ruggedness of the plated solder on a rectangular electrode 16, surface ruggedness of the solder paste applied on the rectangular electrode 16 or vaporization of the component in the solder paste, based on the density difference between the molten solder 20 and the bubble 34, and the bubble 34 is ejected to the outside.</p> |
