| 摘要 |
PROBLEM TO BE SOLVED: To provide a molding die device which can securely release a molded part without deformation, by setting the condition of a prescribed degree and executing ejection without the need of complicated work for subtly adjusting an ejection condition (total surface area of the tip faces of ejector pins and the like). SOLUTION: The molding die device is provided with ejector pins 13 supported so that they freely move forwards/backwards against the molded product in holes 12 provided for a forming face, since an IC chip and a wiring wire on a lead frame are sealed by using a molding material, the packaging of a semiconductor part is finished, and the molded part adhered to the forming face of the mold is peeled after forming. The ejector pins 13 execute a first peeling operation for depressing the molded part at the tip face and detaching it from the forming face by making them protrude toward the molded part adhered to the forming face, and a second peeling operation for saving the pins into the holes 12 after the first peeling operation and dissolving absorption between the tip faces of the ejector pins and the molded part. |
