| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide an aligner with high throughput by simultaneously performing the alignment of substrate to be exposed and mask and the exposure of substrate to be exposed with a scanning-type exposure device. SOLUTION: By dividing a stage 3 for holding a substrate 1 to be exposed into a 1st group and a 2nd group, the substrate 1 to be exposed on the stage 3 of the 2nd group (or 1st group) is aligned to a mask 2, while the substrate 1 to be exposed held on the stage 3 of 1st group (or 2nd group) is exposed. When the substrate 1 to be exposed held on the stage 3 of 1st group (or 2nd group) has been completely exposed, the substrate 1 to be exposed held on the stage 3 of 2nd group (or 1st group) can be immediately exposed so that throughput can be improved.</p> |
