SEMICONDUCTOR DEVICE AND MANUFACTURE THEREOF

摘要

PROBLEM TO BE SOLVED: To realize good heat radiating ability of a pellet mounted to a heat- radiating plate. SOLUTION: A heat radiator plate 3 has a shape such that its central part 10 is located at a position higher than both its end parts 9 and the an upper face of the central part 10 of the plate 3 is exposed. A pellet 2 is mounted on a lower surface of the central part 10 of the plate 3. Since the upper face of the central part 10 of the plate 3 having the pellet 2 mounted on its lower face is exposed from the resin member 8, heat radiation of the pellet 2 can be realized satisfactorily.