| 摘要 |
<p>PROBLEM TO BE SOLVED: To enable firm mounting of a container to an external electric circuit board. SOLUTION: Acontainer 4 includes an insulating base plate 1 and a lid member 2. The insulating base plate 1 is jointed to the lid member 2 by a sealing material 8 to hermetically accommodate an electronic component 3 within the container 4. The base plate 1 and lid member 2 are made of a ceramic material having a thermal expansion coefficient of 10-20 ppm/ deg.C at a temperature of 40-400 deg.C. The sealing material 8 is made of a glass component containing 55-75 weight% of lead oxide, 2-10 weight% of boron oxide, 10-20 weight% of lead fluoride, 1-6 weight% of aluminum oxide, 10-20 weight% of bismuth oxide, and an additive filler component containing 5-15 weight% of willemite compound and 1-5 weight% of lead titanate compound.</p> |
